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Owen J. Hildreth, Devin Brown and Ching P. Wong 3D Out-of-Plane Rotational Etching with Pinned Catalysts in Metal-Assisted Chemical Etching of Silicon Advanced Functional Materials 21

Version of Record online: 3 JUN 2011 | DOI: 10.1002/adfm.201100279

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Scooped-out basins, 50-nm subsurface curved horns, and vertically oriented metal thin films are some of the structures resulting from the use of pinned Ti/Au lithographically patterned structures as catalysts in metal-assisted chemical etching (MACE) of silicon to induce out-of-plane rotational etching. The force and pressure of MACE are calculated to be 0.5–3.5 μN and 0.5–3.9 MPa.

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