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Theo Frot, Willi Volksen, Sampath Purushothaman, Robert L. Bruce, Teddie Magbitang, Dolores C. Miller, Vaughn R. Deline and Geraud Dubois Post Porosity Plasma Protection: Scaling of Efficiency with Porosity Advanced Functional Materials 22

Version of Record online: 17 APR 2012 | DOI: 10.1002/adfm.201200152

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Protecting the porosity of ultralow dielectric constant (k) materials allows for limitation of the processing damage to a constant minimal level, independent of the porosity. This trend holds true on both blanket wafers and patterned structures, highlighting how the post porosity plasma protection (P4) can allow the extendibility of actual semiconductor manufacturing processes to future highly porous dielectrics.

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