Guangbin Dou, Andrew S. Holmes, Eric M. Yeatman, Robert V. Wright, Paul B. Kirby and Chunyan Yin Transfer of Functional Ceramic Thin Films Using a Thermal Release Process Advanced Materials 23
A simple, solder-based bonding and lift-off process for transfer of functional ceramic thin films is demonstrated. The process allows transfer of thin films from a growth wafer onto a target substrate in a single step, with separation from the growth substrate being driven by induced stresses during soldering. Free-standing films can also be produced.
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