E-mail a Wiley Online Library Link

Hsien-Ping Feng, Trilochan Paudel, Bo Yu, Shuo Chen, Zhi Feng Ren and Gang Chen Nanoparticle-Enabled Selective Electrodeposition Advanced Materials 23

Article first published online: 3 MAY 2011 | DOI: 10.1002/adma.201004656

Thumbnail image of graphical abstract

Electrodeposition of a material onto a conducting substrate with strong adhesion and exceptional uniformity through the use of platinum nanoparticles as the seed layer is reported. The use of platinum nanoparticles also creates an optimum voltage range to selectively electroplate various metals on substrate into areas seeded with the nanoparticles.

Complete the form below and we will send an e-mail message containing a link to the selected article on your behalf

Required = Required Field