Matthias E. Bahlke, Hiroshi A. Mendoza, Daniel T. Ashall, Allen S. Yin and Marc A. Baldo Dry Lithography of Large-Area, Thin-Film Organic Semiconductors Using Frozen CO2 Resists Advanced Materials 24
To address the incompatibility of organic semiconductors with traditional photolithography, an inert, frozen CO2 resist is demonstrated that forms an in situ shadow mask. Contact with a room-temperature micro-featured stamp is used to pattern the resist. After thin film deposition, the remaining CO2 is sublimed to lift off unwanted material. Pixel densities of 325 pixels-per-inch are shown.
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