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Matthias E. Bahlke, Hiroshi A. Mendoza, Daniel T. Ashall, Allen S. Yin and Marc A. Baldo Dry Lithography of Large-Area, Thin-Film Organic Semiconductors Using Frozen CO2 Resists Advanced Materials 24

Version of Record online: 11 SEP 2012 | DOI: 10.1002/adma.201202446

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To address the incompatibility of organic semiconductors with traditional photolithography, an inert, frozen CO2 resist is demonstrated that forms an in situ shadow mask. Contact with a room-temperature micro-featured stamp is used to pattern the resist. After thin film deposition, the remaining CO2 is sublimed to lift off unwanted material. Pixel densities of 325 pixels-per-inch are shown.

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