Yuriy I. Yanson and Dr. Marcel J. Rost Structural Accelerating Effect of Chloride on Copper Electrodeposition Angewandte Chemie International Edition 52
Under the microscope: In situ, video-rate scanning-tunneling-microscopy imaging during Cu electrodeposition reveals a profound structural accelerating effect of Cl− on the deposition process (see images). This effect could be present in systems with different metals and different additives. The structural accelerating effect is important for the fundamental understanding of electrodeposition phenomena and for applications in industry.
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