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Xin Gu, Xuegong Yu, Jinglin Xu, Ruixin Fan and Deren Yang Towards thinner and low bowing silicon solar cells: form the boron and aluminum co-doped back surface field with thinner metallization film Progress in Photovoltaics: Research and Applications 21

Version of Record online: 18 OCT 2011 | DOI: 10.1002/pip.1206

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We have demonstrated the screening-printing B and Al mixture metallization film technique for the aim of pushing forward the application of thinner wafers. This technique can raise the carrier concentration in the back surface field by more than one order of magnitude and minimizing the back surface recombination at a low firing temperature (≤800 °C). Using this technique largely reduce the metallization paste thickness at the rear while not degrading the solar cell efficiency.

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