Verena Jung and Marc Köntges Al/Ni : V/Ag metal stacks as rear-side metallization for crystalline silicon solar cells Progress in Photovoltaics: Research and Applications 21
A Ni : V/Ag stack on evaporated Al is investigated as rear-side metallization for silicon solar cells by a thermal aging of solder joints on this metallization. Depending on the presence of Cu on top of the solder, varying intermetallic compounds are formed at the Ni : V/solder interface. By analyzing the reaction kinetics and taking module temperature histograms into account, the necessary minimum Ni : V layer thickness for 25 years lifetime is estimated.
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