Andrés Vásquez Quintero, Danick Briand and Nico F. de Rooij Effect of low-temperature processing on dry film photoresist properties for flexible electronics Journal of Polymer Science Part B: Polymer Physics 51
Lamination of PerMX dry film photoresist at low temperatures on flexible polymers is reported. Mechanical properties, adhesion behavior, and mechanical robustness are assessed for different processing temperatures. Because of its flexible nature, adhesive properties, and patternability, the material is envisaged to be widely used in flexible and printed electronics applications such as encapsulation and integration of foil/silicon components and electrical interconnections.
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