Huan Lin, Shen Xu, Xinwei Wang and Ning Mei Thermal and Electrical Conduction in Ultrathin Metallic Films: 7 nm down to Sub-Nanometer Thickness Small 9
This work reports the first-time measurement of thermal and electrical conduction of ultra-thin metallic films down to 0.6 nm thickness. Significant reductions of more than 80% for electrical and 50% for thermal conductivities are observed. The ultra-thin film's Lorenz number deviates from the bulk value significantly, with an almost 200% increase. Very strong electron reflection (>90%) at grain boundaries is obtained.
Complete the form below and we will send an e-mail message containing a link to the selected article on your behalf