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Katsuyuki Sakuma, Noriyasu Nagai, Mikiko Saito, Jun Mizuno and Shuichi Shoji Simplified 20-µm pitch vertical interconnection process for 3D chip stacking IEEJ Transactions on Electrical and Electronic Engineering 4

Version of Record online: 22 APR 2009 | DOI: 10.1002/tee.20415

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