Microwave and Optical Technology Letters

Cover image for Vol. 56 Issue 11

Edited By: Kai Chang

Impact Factor: 0.623

ISI Journal Citation Reports © Ranking: 2013: 69/82 (Optics); 188/247 (Engineering Electrical & Electronic)

Online ISSN: 1098-2760

Editorial Board


E D I T O R
Kai Chang

Texas A&M University,
College Station,
Texas

E D I T O R I A L   B O A R D
G.P. Agrawal
University of Rochester, USA

J. Archer
CSIRO, Australia

I. J. Bahl
M/A-COM, USA

B. Beker
Advanced Micro Devices, Inc., USA

T. M. Benson
University of Nottingham, United Kingdom

P. Bernardi
University of Rome, Italy

S. Betti
Universita degli Studi de L'Aquila, Italy

K. B. Bhasin
NASA Glenn Research Center,
USA

M.E. Bialkowski
University of Queensland, Australia

S. Caorsi
University of Pavia, Italy

J. Capmany
Universidad Politecnica de Valencia, Spain

H. J. Caulfield
Diversified Research Corporation, USA

W. Chew
University of Illinois, USA

J. Chrostowski
National Research Council, Canada

R. A. Cryan
University of Huddersfield, UK

A. A. de Salles
CETUC-PUC, Brazil

U. Efron
Hughes Research Labs, USA

M. Ettenberg
Suzmar, LLC, USA

H. R. Fetterman
UCLA, USA

L. Figueroa
Boeing Co., USA

T. K. Findakly
Hoechst Celanese Corp., USA

N. N. Fomin
Moscow Technical University,
Russia

T. T. Fong
Hughes Aircraft Co., USA

V. Fouad Hanna
University of Paris, France

V.F. Fusco
Queen's University of Belfast, Northern Ireland

P. B. Gallion
ENST, France

F. Gardiol
École Polytechnique Fédérale,
Switzerland

H. Ghafouri-Shiraz
University of Birmingham, England

J. Goel
Raytheon SAS, USA

P. F. Goldsmith
Cornell University, USA

K. C. Gupta
University of Colorado, USA

G. I. Haddad
University of Michigan, USA

P.S. Hall
University of Birmingham, UK

R. C. Hansen
Consultant, USA

A. Hardy
Tel Aviv University, Israel

J. F. Harvey
Army Research Office, USA

P. R. Herczfeld
Drexel University, USA

W. J. R. Hoefer
University of Victoria, Canada

H. C. Huang
Shanghai Science Technology University,
China

C. Jackson
Raytheon SAS, USA

D. Jackson
University of Houston, USA

D. Jager
Gerhard-Mercator Universitat, Germany

R. Jansen
Industrial Microwave and
RF Techniques Inc., Germany

J.M. Jin
University of Ilinois, USA

M.A. Karim
The City University of New York, USA

L. P. B. Katehi
University of Michigan, USA

E. L. Kollberg
Chalmers University of Technology, Sweden

J. A. Kong
MIT, USA

Y. Konishi
K. Laboratory Co., Ltd., Japan

S. K. Koul
Indian Institute of Technology, India

H. J. Kuno
Quin Star Technology, USA

A. Lakhtakia
Pennsylvania State University, USA

C. H. Lee
University of Maryland, USA

J. N. Lee
Naval Research Labs, USA

K. F. Lee
University of Mississippi, USA

R. Q. Lee
NASA Glenn Research Center, USA

M. S. Leong
National University of Singapore, Singapore

E.H.Li
University of Hong Kong, Hong Kong

T. Li
Bell Telephone Labs, USA

C. Lin
Bell Communication Research, USA

J. C. Lin
University of Illinois, USA

W. Lin
Chengdu Institute of Radio Engineering, China

I. V. Lindell
Helsinki University of Technology,
Helsinki, Finland

H. Ling
University of Texas, USA

N.C. Luhmann
University of California at Davis, USA

J. A. G. Malherbe
University of Pretoria, South Africa

M. Marciniak
Institute of Telecommunications, Poland

K. A. Michalski
Texas A & M University, USA

T. Midford
Hughes Aircraft Co., USA

J. W. Mink
North Carolina State University, USA

R. Mittra
Pennsylvania State University, USA

Y. Naito
Tokyo Institute of Technology, Japan

R. Nevels
Texas A & M University, USA

A. I. Nosich
National Academy Science, Ukraine

J. Ojeda-Castaneda
Instituto National de Astrofisica, Mexico

G. Pelosi
University of Florence, Italy

K. Peterman
Technical University, Berlin, Germany

J. Ra
KAIST, Korea

I. Robertson
University of Surrey, UK

A. Rosen
Drexel University, USA

G. Salmer
Universitéé des Sciences et Techniques,
Lille-Flanders-Artois, France

T.K. Sarkar
Syracuse University, USA

F. K. Schwering
US Army CECOM, USA

A. Seeds
University College London, UK

A. K. Sharma
TRW, USA

L. C. Shen
University of Houston, USA

D. W. Smith
Corning Research Centre, England

B. E. Spielman
Washington University in St. Louis, USA

C. Sun
California Polytechnic State University, USA


C. S. Tsai
University of California at Irvine, USA

L. Tsang
University of Washington, USA

H. Q. Tserng
Texas Instruments, USA

J. B. Y. Tsui
Wright-Patterson AFB, USA

A. V. Vorst
Catholic University, Belgium

O. Wada
Kobe University

R. W. Wang
Academia Sinica, China

B. Wilhelmi
Jenoptik AG, Germany

A. G. Williamson
University of Auckland, New Zealand

J. C. Wiltse
Georgia Technology Research Institute, USA

K.L. Wong
National Sun Yat-Sen University, Taiwan

J. Wu
National Taiwan University, Taiwan

K. Wu
Ecole Polytechnique de Montreal, Canada

E. Yamashita
University of Electro-Communications, Japan

S. K. Yao
Optech, USA

H. W. Yen
Hughes Research Labs, USA

F. T. S. Yu
Pennsylvania State University, USA

E. Yung
City University of Hong Kong, Hong Kong

W.X. Zhang
Nanjing, China

J o u r n a l   P r o d u c t i o n

John Wiley & Sons
Diana Schaeffer
Microwave and Optical Technology Letters



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