Packaging Technology and Science

Cover image for Vol. 29 Issue 7

Editors-in-Chief: David Shires, Diana Twede

Impact Factor: 1.292

ISI Journal Citation Reports © Ranking: 2015: 23/42 (Engineering Manufacturing); 66/124 (Food Science & Technology)

Online ISSN: 1099-1522

Editorial Board


EDITORS-IN-CHIEF

David Shires
Smithers Pira,
Home Office: 29 Dalmeny Road, Carshalton, Surrey, SM5 4PW, UK
e-mail: pts@shires.me.uk

Diana Twede
School of Packaging, Michigan State University, East Lansing, MI 48824, USA
e-mail: twede@msu.edu

ASSOCIATE EDITORS

Cristina Nerin
University of Saragoza,
Spain

Gordon L. Robertson
University of Queensland,
Brisbane, Australia

Renee Wever
Linköping University,
Sweden

EDITORIAL BOARD

G. Batt
Clemson University, USA

A. L. Brody
The University of Georgia
and Packaging/Brody, Inc.,
Georgia, USA

V. Chonhenchob
Kasetsart University
Bangkok, Thailand

K. Cooksey
Clemson University,
South Carolina, USA

J. de la Fuente
California Polytechnic State University, USA

A. East
Massey University, New Zealand

M. Galotto
University of Santiago de Chile (USACH), Chile

R. Gavara
IATA-CSIC,
Spain

T. Goedecke
Federal Institute for Materials,
Research and Testing,
Berlin, Germany

D.L. Goodwin
Rochester Institute of Technology,
New York, USA

C. Guzman-Siller
Universidad de Monterrey, San Pedro, Garza Garcia, Mexico

C. Koelsch Sand
Packaging Technology and Research
Michigan State University

D. S. Lee
Kyungnam University,
Changwon, South Korea

A. Olsson
Lund University, sweden

S. Østergaard
Danish Technological Institute, Taastrup, Denmark

M. Pascall
Food Innovation Center,
Ohio State University, USA

L. Piergiovanni
Universita di Milano,
Milan, Italy

V. Rouillard
Victoria University,
Melbourne, Australia

K. Saito
Kobe University, Japan

K. Sonneveld
Victoria University of Technology, Melbourne, Australia

S. Tondella Dantas
ITAL Institute of Food Technology,
Campinas, Brazil

K. Verghese
RMIT University,
Melbourne, Australia

J. Wang
Jiangnan University,
P.R. China

Z. W. Wang
Jinan University,
Guangzhou, P.R. China

F. Welle
Fraunhofer Institute for Process Engineering and Packaging,
Freising, Germany

Y. Wyser
Nestle Research Center,
Lausanne, Switzerland

K. L. Yam
Rutgers State University,
New Brunswick,
New Jersey, USA

A. Yoxall

Sheffield Hallam University, UK


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