Copyright © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Editor-in-Chief: Peter Gregory, Deputy Editors: Martin Ottmar, Carolina Novo da Silva, Lorna Stimson
Online ISSN: 1521-4095
Associated Title(s): Advanced Energy Materials, Advanced Engineering Materials, Advanced Functional Materials, Advanced Healthcare Materials, Advanced Materials Interfaces, Advanced Optical Materials, Particle & Particle Systems Characterization, Small
Organic Memory: Three-Dimensional Integration of Organic Resistive Memory Devices (Adv. Mater. 44/2010)
Takhee Lee and co-workers demonstrate on p. 5048 the fabrication of three-dimensionally stacked 8 × 8 cross-bar array organic resistive memory devices. These devices show non-volatile memory switching behavior, and individual memory cells in the different layers are independently controlled and monitored. The demonstrated 3D stacking fabrication will enable high-density integration of organic memory cells and other organic-based electronics devices.