Plasma Processes and Polymers

Cover image for Vol. 13 Issue 7

Online ISSN: 1612-8869

Recently Published Issues

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Special Issues


  • Plasma Conversion
    Editor-in-Chief: Christian Oehr
    Guest Editor: Tomohiro Nozaki (Tokyo Institute of Technology, Japan)

  • Plasma and Agriculture
    Editor-in-Chief: Pietro Favia

  • Plasma Modelling
    Editor-in-Chief: Michael Wertheimer
    Guest Editor: Annemarie Bogaerts (University of Antwerp, Belgium)

  • Plasma Diagnostics
    Editor-in-Chief: Riccardo d’Agostino

  • Plasma and Liquids
    Editor-in-Chief: Riccardo d’Agostino
    Guest Editors: Petr Lukes (Institute of Plasma Physics, Prague, Czech Republic) and Bruce R. Locke (Florida State University, USA)

  • Plasma and Cancer III
    Editor-in-Chief: Pietro Favia
    Guest Editor: Mounir Laroussi (Old Dominion University, USA)


Recently Published Articles

  1. Synthesis of Micro- and Nanomaterials in CO2 and CO Dielectric Barrier Discharges

    Igor Belov, Jens Vanneste, Morteza Aghaee, Sabine Paulussen and Annemie Bogaerts

    Version of Record online: 29 JUL 2016 | DOI: 10.1002/ppap.201600065

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    Dielectric Barrier Discharges operating in CO and CO2 form solid products at atmospheric pressure. The main differences between both plasmas and their deposits are analyzed keeping similar energy input.

  2. Superhydrophobic Paper by Facile and Fast Atmospheric Pressure Plasma Etching

    Panagiotis Dimitrakellis, Anastasios Travlos, Vassilios P. Psycharis and Evangelos Gogolides

    Version of Record online: 27 JUL 2016 | DOI: 10.1002/ppap.201600069

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    Atmospheric pressure dielectric barrier discharge plasma operating in He/O2 is successfully applied for the selective etching of organic matter over the inorganic fillers in paper surfaces resulting in an enhanced micro- and nano-topography. Subsequent deposition of a very thin fluorocarbon coating leads to superhydrophobic and in some extent oleophobic paper.

  3. Plasma Polymers Containing Sulfur and Their Co-Polymers With 1,7-Octadiene: Chemical and Structural Analysis

    Kim S. Siow, Leanne Britcher, Sunil Kumar and Hans J. Griesser

    Version of Record online: 27 JUL 2016 | DOI: 10.1002/ppap.201600044

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    Plasma polymerization of DMSO or DMSO with 1,7-octadiene produces coatings containing S in low oxidation states. Bias potentials during polymerization has no effect on 1,7-octadiene-DMSO plasma co-polymers. DMSO plasma polymers are resistant to further modification by hydrogen peroxide. While there are some changes in the composition of DMSO plasma polymer, the S does not oxidize further during air aging over 129 days.

  4. Molecular Surface Analysis and Depth-Profiling of Polyethylene Modified by an Atmospheric Ar-D2O Post-Discharge

    Vanina Cristaudo, Stéphanie Collette, Nunzio Tuccitto, Claude Poleunis, Luigi Cesare Melchiorre, Antonino Licciardello, François Reniers and Arnaud Delcorte

    Version of Record online: 21 JUL 2016 | DOI: 10.1002/ppap.201600061

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    The reactivity of deuterated water vapors with PE films, modified by an atmospheric Ar-D2O post-discharge, is traced both at the polymer surface and along the depth, by using static and dynamic time-of-flight secondary ion mass spectrometry. The dependences of the oxidative functionalization on the time of treatment and the gap between sample and plasma source are elucidated in order to tune the chemical and structural modifications of the outermost polymer layers.

  5. Deposition of Copper Oxide Coatings With an Atmospheric Pressure Plasma Source: I − Characterization of the Plasma

    Johannes Gruenwald, Katja Fricke, Maik Fröhlich and Martin Polak

    Version of Record online: 21 JUL 2016 | DOI: 10.1002/ppap.201600046

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    Systematic optical emission spectroscopy measurements of a non-thermal atmospheric pressure DC plasma have been performed in order to get insight into the different species in the plasma. The plasma was ignited in pure nitrogen, while copper was introduced via a target electrode. This work is a first step towards a thorough understanding of this special type of copper containing nitrogen plasma at atmospheric pressure for the deposition of copper oxide films.