Advanced Functional Materials

Cover image for Vol. 27 Issue 28

20_02/2010Silicon Microstructures: Detachment Lithography of Photosensitive Polymers: A Route to Fabricating Three-Dimensional Structures (Adv. Funct. Mater. 2/2010)

The scanning electron microscope image featured on the front cover shows a three-dimensional polydimethylsiloxane (PDMS) molded film bonded on a glass rod. Multilevel silicon structures used to mold the PDMS film were fabricated from successive steps of detachment lithography of photoresist films, which are patterned with lithography and reactive ion etching, as reported by J. Yeom and M. A. Shannon on page 289. The smallest feature on the pyramid is 2 µm in diameter.

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