Thermally Triggered Degradation of Transient Electronic Devices
Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Present address: Decontamination and Decommissioning Research Division, Korea Atomic Energy Research Institute, Daedeok-daero 898-111, Yuseong-gu, Daejeon, South Korea
Search for more papers by this authorDepartment of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Mechanical Science and Engineering, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Chemistry Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Chemistry Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Materials Science and Engineering Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Chemistry Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Materials Science and Engineering, Chemistry, Mechanical Science and Engineering Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials, Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorCorresponding Author
Department of Aerospace Engineering Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
E-mail: swhite@illinois.eduSearch for more papers by this authorBeckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Present address: Decontamination and Decommissioning Research Division, Korea Atomic Energy Research Institute, Daedeok-daero 898-111, Yuseong-gu, Daejeon, South Korea
Search for more papers by this authorDepartment of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Mechanical Science and Engineering, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Chemistry Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Chemistry Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Materials Science and Engineering Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Chemistry Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorDepartment of Materials Science and Engineering, Chemistry, Mechanical Science and Engineering Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials, Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
Search for more papers by this authorCorresponding Author
Department of Aerospace Engineering Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL, 61801 USA
E-mail: swhite@illinois.eduSearch for more papers by this authorAbstract
Thermally triggered transient electronics using wax-encapsulated acid, which enable rapid device destruction via acidic degradation of the metal electronic components are reported. Using a cyclic poly(phthalaldehyde) (cPPA) substrate affords a more rapid destruction of the device due to acidic depolymerization of cPPA.
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| adma201501180-sup-0001-S1.pdf6.1 MB | Supplementary |
| adma201501180-sup-0002-S2.mp46.8 MB | Supplementary |
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