Advanced Functional Materials
Full Paper

Epidermal Supercapacitor with High Performance

Pingshan Luan

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

Present address: Department of Materials Science and Engineering, University of Maryland, College Park, MD 20742, USA

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Nan Zhang

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

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Weiya Zhou

Corresponding Author

E-mail address: wyzhou@iphy.ac.cn

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

E‐mail:

wyzhou@iphy.ac.cn

,

zqniu@nankai.edu.cn

,

ssxie@iphy.ac.cn

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Zhiqiang Niu

Corresponding Author

E-mail address: zqniu@nankai.edu.cn

Key Laboratory of Advanced Energy Materials Chemistry (Ministry of Education), College of Chemistry, Collaborative Innovation Center of Chemical Science and Engineering, Nankai University, Tianjin, 300071 China

E‐mail:

wyzhou@iphy.ac.cn

,

zqniu@nankai.edu.cn

,

ssxie@iphy.ac.cn

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Qiang Zhang

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

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Le Cai

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

Present address: Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI 48824, USA

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Xiao Zhang

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

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Feng Yang

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

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Qingxia Fan

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

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Wenbin Zhou

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

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Zhuojian Xiao

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

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Xiaogang Gu

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

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Huiliang Chen

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

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Kewei Li

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

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Shiqi Xiao

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

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Yanchun Wang

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

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Huaping Liu

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

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Sishen Xie

Corresponding Author

E-mail address: ssxie@iphy.ac.cn

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing, 100190 China

Beijing Key Laboratory for Advanced Functional Materials and Structure Research, Beijing, 100190 China

School of Physical Sciences, University of Chinese Academy of Sciences, Beijing, 100049 China

E‐mail:

wyzhou@iphy.ac.cn

,

zqniu@nankai.edu.cn

,

ssxie@iphy.ac.cn

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First published: 22 September 2016
Citations: 32
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Abstract

Recent development in epidermal and bionic electronics systems has promoted the increasing demand for supercapcacitors with micrometer‐thickness and good compatibility. Here, a highly flexible free‐standing epidermal supercapacitor (SC‐E) with merely 1 μm thickness and high performance is developed. Single‐walled carbon nanotube/poly(3,4‐ethylenedioxythiophene) hybrid films with unique inner‐connected reticulation are adopted as electrodes for ultrathin structure and high electric conductivity. Then, based on two substrates with different surface energies, a stepwise lift‐off method is presented to peel off the ultrathin integrated supercapacitor from the substrates nondestructively. As a result of the high conductive hybrid electrodes and the thin electrolyte layer, the as‐designed supercapacitors (based on the total mass of two electrodes) achieve a good capacitance of 56 F g−1 and a superhigh power density of 332 kW kg−1, which manifest superior performance in contrast to the other devices fabricated by traditional electrodes. Meanwhile, the ultrashort response time of 11.5 ms enables the epidermal supercapacitor (SC‐E) work for high‐power units. More importantly, the free‐standing structure and outstanding flexibility (105 times bending) endow the SC‐E with excellent compatibility to be integrated and work in the next generation of smart and epidermal systems.

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