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Thick Film Capacitor Materials of the Powder–Glass Binary Systems and Their Dielectric Properties
- Pages: 147-152
- First Published: 01 January 1981
Article
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Application-Oriented Description of the Quality of Electronic Components (ppm Concept)
- Pages: 153-156
- First Published: 1981
Article
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The Application of New Du Pont/USA/Copper Composition for Manufacturing of Thick-Film Microwave Low Loss Resonators on L and X Band
- Pages: 157-163
- First Published: 1981
Article
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Response to Comments on Paper on Grain Boundary Scattering Model for Metals
- Pages: 105-109
- First Published: 1981
Article
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Thick Film Circuits: Present State and Future Development
- Pages: 131-137
- First Published: 1981
Article
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Permanent Interconnection Technology Electronic Interconnections – the Printed Wiring Board
- Pages: 139-145
- First Published: 1981
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Three Dimensional Analytical Separation of Grain Boundary and Surface Scatterings in Polycrystalline Metal Films in the Case of Non Cubic Grains
- Pages: 125-130
- First Published: 18 November 1980
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The Influence of the Area of a Thin Film Capacitor on the Breakdown Voltage
- Pages: 111-114
- First Published: 16 November 1980
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Open Access
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The Influence of Filter Parameters on the Response of Ceramic Filters Operating in the Thickness-Twist Mode
- Pages: 115-124
- First Published: 12 November 1980